GRAND RAPIDS, Mich. and ZURICH, Switzerland, June 21, 2017 (SEND2PRESS NEWSWIRE) — eAgile Inc., a global leader in Internet of Things (IoT) technologies, announced today the release of their eLink(TM) solution for mobile eCommerce. eLink is the first to combine smartphone-based one-tap ordering, product authentication and customer engagement functions with enterprise-level track and trace visibility […]
Tag Archives | eAgile, Inc.
NEWS: eAgile Announces partnership with Heinlein Plastik to bring eSeal RFID Solution to Europe
GRAND RAPIDS, Mich. USA, and ZURICH, Switzerland, Sept. 29, 2016 (SEND2PRESS NEWSWIRE) — eAgile Inc., a global leader in radio frequency identification (RFID) technologies, announces a partnership with Heinlein Plastik-Technik GmbH to bring RFID smart packaging solutions to the European cap and closure marketplace. eSeal is the first turnkey solution engineered to integrate the benefits […]
NEWS: eAgile Announces the Production Launch of the eSeal RFID Solution for Sealed Caps and Closures
GRAND RAPIDS, Mich. and ZURICH, Switzerland, Jan. 26, 2016 (SEND2PRESS NEWSWIRE) — eAgile Inc., a global leader in radio frequency identification (RFID) technologies, announces the successful high-volume production launch of the eSeal heat induction solution. eSeal is the first turnkey solution engineered to integrate the benefits of RFID into the billions of caps and closures […]
NEWS: eAgile Launches First Dual Frequency RFID Inlay
GRAND RAPIDS, Michigan and ZURICH, Switzerland, April 7, 2015 (SEND2PRESS NEWSWIRE) — eAgile Inc., a global leader in radio frequency identification (RFID) technologies announced today their UHF and NFC multi-frequency DualWing(TM) family of inlays. The DualWing series is the first tag to seamlessly combine the benefits of UHF’s global supply chain acceptance with the consumer […]
NEWS: eAgile Launches the World’s Smallest High Performance UHF Inlay for Item-Level Intelligence
GRAND RAPIDS, Mich. and ZURICH, Switzerland, Jan. 13, 2015 (SEND2PRESS NEWSWIRE) — eAgile Inc., a global leader in radio frequency identification (RFID) technologies, announced today the release of their new UHF EPC compliant MicroWing(TM) inlay. The MicroWing is the size of a paper clip which makes it the smallest RFID inlay available on the market […]
NEWS: New System Captures Full Potential of the iPhone 6 NFC Capabilities for ‘Smart’ Consumer Goods
GRAND RAPIDS, Mich., Sept. 9, 2014 (SEND2PRESS NEWSWIRE) — Leading RFID specialist eAgile Inc. announced their eTap(TM) solution today for an intelligent packaging solution for consumer products utilizing near field communication (NFC). This announcement is concurrent with Apple’s(R) news that the new iPhone(R) 6 will join the rest of the smartphone marketplace incorporating NFC capabilities.
NEWS: eAgile Awarded Patent for RFID Intelligent Packaging Breakthrough
GRAND RAPIDS, Mich., Aug. 12, 2014 (SEND2PRESS NEWSWIRE) — eAgile Inc., a global leader in radio frequency identification (RFID) technologies, announced today that the U.S. Patent Office has granted a patent for the company’s eSeal(TM) RFID-enabled packaging solution. The eSeal solution solves many of the underlying concerns surrounding the nearly one trillion containers consumed annually […]
NEWS: eAgile Awarded Patent for RFID Technology Breakthrough
GRAND RAPIDS, Mich., Feb. 18, 2014 (SEND2PRESS NEWSWIRE) — eAgile, Inc., a global leader in radio frequency identification (RFID) technologies, announced today the U.S. Patent Office has granted a patent for the company’s eSync(TM) technology. eSync(TM) has been proven to solve many of the vexing problems which have plagued the RFID industry for years by […]
eAgile Inc. Attains ISO 9001:2008 Certification
GRAND RAPIDS, Mich. /CitizenWire/ — eAgile, Inc. announced today the organization has achieved one of the most comprehensive ISO 9001:2008 certifications within the Radio Frequency Identification (RFID) industry. On January 24, eAgile received formal registration approval and is now officially recognized as an ISO 9001:2008 certified company applicable to the design and manufacture of electronic […]